Epoxy Adhesive, Clear, 1 in Dia, 3 in L, 30 sec Begins to Harden, 264 PK
| Item | Epoxy Adhesive |
|---|---|
| Product Form | Smooth Sticks |
| Diameter | 1 in |
| Length | 3 in |
| Materials Bonded | Paper, Plastic, Wood |
| Working Time | 30 sec |
| Melting Temperature | 250 Degrees to 380 Degrees F |
| Begins to Harden | 30 sec |
| Color | Clear |
| Electrically Insulating | No |
| High Tack | No |
| Series | 3797 |
| Application | Good For Electrical Potting |
| Full Cure | 24 hr |
| Shear Strength | 350 psi |
| Tensile Strength | 283 psi |
| Substrates | Many Acrylics and Some Polyolefin |
| Melting Temp. - Glues | 170 Degrees F |
| Peel Strength | 10 psi |
| Diameter - Glue Sticks | 1 in |
| Length - Glue Sticks | 3 in |
| For Use With | Scotch-Weld Applicator PG II with Speed loader |
| Characteristics | Good Resistance to Flow at Elevated Temperatures |
| Temp. Range | -20 to 200 deg F |
| Green Environmental Attribute | Does Not Contain Methylene Chloride |
| Product Format | Smooth Sticks |
| Primary Applications | Electronics |
| UV Resistant | No |
| Maximum Performance Temperature | 200 deg F |
| Low Odor | No |
| Maximum Viscosity | 2,650 cps |
| Minimum Performance Temperature | -20 deg F |
| Compatible Applicator Size | PG |
| Pressure Sensitive | No |
| Full Cure Time | 24 hr |
| Features | 100% Solids, For Use with 3M Hot Melt Applicator PG II, Heat Resistant, Low Viscosity Adhesive Flows Easily Into Small Areas for Effective Coverage and Protection, Quick 30 sec Open Bead Time for Potting Even At Depth, Thermoplastic |
| Minimum Viscosity | 2,650 cps |
| FDA Compliance | 21 CFR 175.105 |
| Open Time | 30 sec |
| Material | Wood, Paper, Plastic |
| Container Type | Can |
| Begins to Harden - Adhesives | 30 sec |
| Full Cure Time - Adhesives | 24 hr |
| Country of Origin (subject to change) | United States |
| Package Quantity | 264 |