8134-HC-8P2=HOLTITE CONTACT 3.
| Hole Size (Recommended) | 1.47 mm [ .058 in ] |
|---|---|
| Termination Method to PC Board | Through Hole - Press-Fit |
| Spring Material | Beryllium Copper |
| Operating Temperature Range | -65 to 125 °C [ -85 to 257 °F ] |
| Termination Method to Wire/Cable | Solder |
| Contact Type | Socket |
| Applies To | Printed Circuit Board |
| Profile | Zero |
| Contact Base Material | Copper |
| Contact Mating Area Plating Material | Gold |
| Contact Transmits (Typical) | Signal /Power |
| Insertion Method | Hand/Semi-Automatic |
| Contact Spring Plating Material | Tin |
| Wire/Cable Type | Discrete Wire |
| Socket Type | Discrete |
| Sleeve Plating Material | Tin |
| Mating Pin Diameter Range | .64 to .89 mm [ .025 to .035 in ] |
| Contact Current Rating (A) | 5 |
| Product Type | Contact |
| Socket Length | 3.45 mm [ .136 in ] |
| Sleeve Material | Copper |
| PCB Thickness (Recommended) | .79 to 3.18 mm [ .03 to .05 in ] |
| Package Quantity | 1 |