Nuevo ensamble de conector wafer 2.0 RA 8Ckt, ideal para aplicaciones técnicas
| PCB Thickness - Recommended | 1.6 mm |
|---|---|
| Material - Resin | Nylon |
| Plating min - Termination | 1.016µm |
| Lock to Mating Part | Yes |
| Circuits (Loaded) | 8 |
| Shrouded | Partial |
| Material - Metal | Brass |
| Temperature Range - Operating | -40° to +105°C |
| PCB Retention | Yes |
| Pitch - Mating Interface | 2 mm |
| Plating min - Mating | 1.016µm |
| Number of Rows | 1 |
| UL | E29179 |
| Voltage - Maximum | 125 V |
| Durability (mating cycles max) | 30 |
| Material - Plating Mating | Tin |
| Material - Plating Termination | Tin |
| PC Tail Length | 3.5 mm |
| Termination Interface: Style | Through Hole |
| Circuits (maximum) | 8 |
| Polarized to Mating Part | Yes |
| Orientation | Right Angle |
| Current - Maximum per Contact | 2 A |
| Package Quantity | 1 |