SHORT POINT RECP CONT LP
| Wire Contact Termination Area Plating Material | Tin |
|---|---|
| Contact Base Material | Copper Alloy C7025 |
| Contact Type | Socket |
| Contact Transmits (Typical) | Signal /Power |
| Product Type | Contact |
| Connector & Contact Terminates To | Cable, Wire |
| Contact Style | Crimp Snap-in |
| Wire/Cable Type | Discrete Wire |
| Dielectric Withstanding Voltage | 750 V |
| Wire Insulation Support | With |
| Termination Method to Wire & Cable | Crimp |
| Contact Mating Area Plating Thickness | 30µin |
| Insulation Diameter | 0.025 to 0.06 in |
| Crimp Area Plating Thickness | 50 µin |
| Applied Pressure | Standard |
| Insulation Resistance | 5,000 megaohm |
| Operating Voltage | 300 VAC |
| Termination Resistance | 12 milliohm |
| Approved Standards | UL E28476, CSA LR7189 |
| Operating Temperature Range | -65 to 105 deg C |
| Wire/Cable Size | 26 to 22 AWG |
| Contact Current Rating (Max) | 3 A |
| Contact Mating Area Plating Material | Gold |
| Contact Termination Area Plating Material | Gold |
| Package Quantity | 1 |