Socket Min-Spr W/H Sn-Au Ser-1
| Sleeve Style | Open Bottom |
|---|---|
| Contact Base Material | Copper |
| Insertion Method | Hand/Semi-Automatic |
| Hole Size (Recommended) | 0.041 in |
| Spring Material | Beryllium Copper |
| Product Type | Contact |
| Sleeve Plating Material | Tin |
| Termination Method to Wire & Cable | Solder |
| Wire/Cable Type | Discrete Wire |
| Connector & Contact Terminates To | Printed Circuit Board |
| Sleeve Material | Copper |
| Socket Length | 0.142 in |
| Termination Method to Printed Circuit Board | Through Hole - Press-Fit |
| Connector System | Cable-to-Board |
| Contact Spring Plating Thickness | 30 µin |
| Contact Type | Socket |
| Contact Mating Area Plating Thickness | 30µin |
| Operating Temperature Range | -65 to 125 deg C |
| Wire/Cable Size | 28 to 25 AWG |
| Contact Transmits (Typical) | Signal /Power |
| Mating Pin Diameter Range | 0.013 to 0.02 in |
| Socket Type | Discrete |
| Profile | Zero |
| Contact Spring Plating Material | Gold |
| Contact Current Rating (Max) | 5 A |
| Circuit Application | Signal |
| PCB Thickness (Recommended) | .031 to .125 in |
| Package Quantity | 1 |