Static dissipative polyimide labels withstand wave solder environments and multiple harsh washes for printed circuit board and electronic component preprocess labeling. Low-profile, high-temperature, glossy white polyimide material features a static dissipative adhesive and static dissipative release liner. Surface resistivity values in the recommended range for dissipative ESD packaging materials as defined by ANSI/ESD S541-2008. UL approved and meets requirements of MIL-STD-202G, Method 215K. Service temperature of -94° to 212°F -70° to 100°C.
| Country of Origin (subject to change) | United States |
|---|---|
| Package Quantity | 1 |